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Team Group ELITE memory module 16 GB 1 x 16 GB DDR4 260-pin SO-DIMM
SKU
TED416G2666C19-S01
- All new generation product of DRAM module
- 1.2V memory module
- Massive 32GB Kit
Category: Memory Modules
| Internal memory type | DDR4 |
|---|---|
| Memory clock speed | 2666 MHz |
| Memory form factor | 260-pin SO-DIMM |
| Component for | Notebook |
| SKU | TED416G2666C19-S01 |
| EAN | 0765441642706 |
| Manufacturer | Team Group |
| Availability | In Stock |
| Product Family | Elite |
TEAMGROUP's ELITE series has released an all-new DDR4 SO-DIMM product which is compliant with JEDEC international standard. With only 1.2V of working voltage, it can save electricity use by 20% compared to its last generation. Therefore, the heat generated from the product itself can also be reduced and maintain the surrounding temperature of the system. It is 100% compatible with INTEL's latest X99 & Skylake chipset. With selected high-quality IC chips and strict testing standard, it is the perfect choice for laptop users, who seek for excellent quality, optimal performance, stability and compatibility.
| Memory | |
|---|---|
| Package type | Blister |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 19 |
| Memory voltage | 1.2 V |
| Module configuration | 1024M x 8 |
| ECC | No |
| Memory clock speed | 2666 MHz |
| Internal memory type | DDR4 |
| Power | |
| Memory voltage | 1.2 V |
| Features | |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 19 |
| Memory voltage | 1.2 V |
| Module configuration | 1024M x 8 |
| Windows operating systems supported | Yes |
| Mac operating systems supported | Yes |
| ECC | No |
| Memory clock speed | 2666 MHz |
| Internal memory type | DDR4 |
| Harmonized System (HS) code | 84733020 |
| System requirements | |
| Windows operating systems supported | Yes |
| Mac operating systems supported | Yes |
| Weight & dimensions | |
|---|---|
| Width | 67.6 mm |
| Height | 30 mm |
| Package type | Blister |
| Packaging data | |
| Package type | Blister |
| Logistics data | |
| Harmonized System (HS) code | 84733020 |
| Other features | |
| Harmonized System (HS) code | 84733020 |
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|---|---|---|---|---|---|---|
| SKU |
TED416G2666C19-S01
|
F3-12800CL10D-16GBXL
|
F3-12800CL10S-8GBXL
|
KVR16N11/8
|
F3-1600C11D-8GRSL
|
F3-2133C10D-16GAB
|
| Manufacturer |
Team Group
|
G.Skill
|
G.Skill
|
Kingston Technology
|
G.Skill
|
G.Skill
|
| ECC |
N
|
N
|
N
|
N
|
N
|
N
|
| Memory form factor |
260-pin SO-DIMM
|
240-pin DIMM
|
240-pin DIMM
|
240-pin DIMM
|
204-pin SO-DIMM
|
240-pin DIMM
|
| Memory layout (modules x size) |
1 x 16 GB
|
2 x 8 GB
|
1 x 8 GB
|
1 x 8 GB
|
2 x 4 GB
|
2 x 8 GB
|
| Internal memory type |
DDR4
|
DDR3
|
DDR3
|
DDR3
|
DDR3
|
DDR3
|
| Component for |
Notebook
|
PC/server
|
PC/server
|
N/A
|
Notebook
|
PC/server
|
| Internal memory |
16GB
|
16GB
|
8GB
|
8GB
|
8GB
|
16GB
|





