Iceberg Thermal FUZEIce heat sink compound Thermal paste 11.25 W/m·K 3.5 g

Low Temperature with High Thermal Conductivity Evenly spread layers of thermal paste with a high thermal conductivity of 11.25 W/mK, ensures high-efficiency heat transfer, allowing for higher clock speeds, and keeping your system in peak condition No Spatula? No Problem! Precision Applicator and Angled Spreader Combination designed with Ease of Use in mind. Making it simple to apply with less mess. Superior Operational Temperature FUZEIce™ can handle up to 200°C and last for years! There’s no paste like FUZEIce™ No Fuss, No Muss, No Problem