DeLOCK 18474 heat sink compound Thermal pad 3 W/m·K

SKU

18474

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In Stock: 75 available

Thermal pad, 3 W/mK

Category: Heat Sink Compounds

More Information

More Information
SKU	18474
EAN	4043619184743
Manufacturer	DeLOCK
Availability	In Stock

Description

This thermal conductive pad by Delock is suitable for heat dissipation, for example, on an M.2 module. The goal of the pad is to improve performance and increase the service life of the components.

Specifications

Features
Type	Thermal pad
Thermal conductivity	3 W/m·K
Operating temperature (T-T)	-60 - 180 °C
Product colour	Grey
Weight & dimensions
Width	20 mm
Depth	70 mm
Height	1.75 mm
Packaging data
Package type	Polybag
Quantity per pack	1 pc(s)

Technical details
Package type	Polybag
Thermal conductivity	3 W/m·K
Operating temperature (T-T)	-60 - 180 °C
Operational conditions
Operating temperature (T-T)	-60 - 180 °C
Colour
Product colour	Grey
Logistics data
Country of origin	China, Taiwan
Quantity per pack	1 pc(s)

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