DeLOCK 18469 heat sink compound Thermal pad 3.2 W/m·K

This thermal conductive pad by Delock is suitable for heat dissipation, for example, on an M.2 module. The goal of the pad is to improve performance and increase the service life of the components.

Low oil bleeding
This pad releases very little oil, which protects electronic components and contacts from contamination and can provide a longer lifespan. Pads with ‘low oil bleeding’ retain their thermal and mechanical properties better and thus ensure even and stable heat dissipation.